Veeco Ships First Laser Annealing System from New San Jose Manufacturing Plant Designed to … | Nation / World

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PLAINVIEW, NY, November 22, 2021 (GLOBE NEWSWIRE) – Veeco Instruments Inc. (NASDAQ: VECO) today announced that it has shipped the first LSA101 spike laser annealing system from its new plant in San Jose, Calif., To a major semiconductor manufacturer. Veeco’s new SEMI-compliant facility serves as the company’s center of excellence for the development and production of advanced laser annealing and packaging lithography systems for semiconductor applications.

“We are extremely proud to ship our first LSA system from our state-of-the-art facility in the heart of Silicon Valley,” commented Bill Miller, CEO of Veeco. “In line with the company’s growth strategy, this new manufacturing space allows Veeco to serve the world’s leading semiconductor chip suppliers with increased capacity and world-class laboratory space. We look forward to presenting this flagship location to our laser annealing and advanced packaging lithography customers for years to come. Thanks to the Veeco team who have worked diligently on an accelerated schedule to enable this exciting milestone in Veeco’s history. “

Veeco’s new facility includes approximately 70,000 square feet of manufacturing and engineering lab space and 30,000 square feet of office space. The manufacturing space will be almost double that of Veeco’s old factory in San Jose and will improve manufacturing efficiency. The new facility is specially designed to meet the growing demand for advanced laser annealing and packaging lithography technologies from Veeco.

Advanced scaling of semiconductor devices requires higher temperature for dopant activation with shorter time at temperature to avoid dopant diffusion. Veeco’s patented LSA101® and LSA201® Laser Spike Annealing (LSA) systems deliver the highest temperatures at the microsecond scale. The unique nature of the LSA platform enables our customers to anneal intricate patterns with uniformity and precision at high temperature, which is highly desired in advanced device processing.

About Veeco

Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor processing equipment. Our proven ion beam, laser annealing, lithography, MOCVD, and unique wafer etching and cleaning technologies play a critical role in the manufacturing and packaging of advanced semiconductor devices. With equipment designed to optimize performance, efficiency and cost of ownership, Veeco holds leading technological positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.

Forward-looking statements

This press release contains “forward-looking statements”, within the meaning of the safe harbor provisions of the United States Private Securities Litigation Reform Act of 1995, as amended, which are based on the expectations, estimates, projections and assumptions of management. Words such as “expects”, “anticipates”, “plans”, “believes”, “expected”, “estimates” and variations of these words and similar expressions are intended to identify forward-looking statements. Forward-looking statements include, without limitation, those regarding the growth and anticipated trends of our businesses and markets, industry prospects and demand drivers, our investment and growth strategies, our development of new products and technologies, our business outlook for future periods, the impact of the COVID-19 pandemic, our ongoing transformation initiative and its effects on our operations and financial results; and other statements which are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and do not constitute guarantees of future performance. Factors which could cause actual results to differ materially from those expressed or implied by such statements include, but are not limited to: the level of demand for our products; global economic and industrial conditions; the effects of regional or global health epidemics, including the effects of the COVID-19 pandemic on the operations of the Company and those of our customers and suppliers; global trade issues, including ongoing trade disputes between the United States and China, and changes in trade and export licensing policies; our reliance on third party vendors and outsourcing partners; the timing of customer orders; our ability to develop, deliver and support new products and technologies; our ability to expand our current markets, increase our market share and develop new markets; the concentrated nature of our clientele; our ability to obtain and protect intellectual property rights in key technologies; our ability to meet the objectives of operational and strategic initiatives and to attract, motivate and retain key employees; variability in results between products and end markets, and our ability to accurately predict future results, market conditions and customer requirements; the impact of our indebtedness, including our senior convertible bonds and our capped purchase transactions; and other risks and uncertainties described in our SEC documents on Forms 10-K, 10-Q and 8-K, and from time to time in our other SEC reports. All forward-looking statements speak only to management’s expectations, estimates, projections and assumptions as of the date of this press release or, in the case of any document referenced herein or incorporated by reference, the date of this document. The Company assumes no obligation to publicly update or revise any forward-looking statements to reflect events, circumstances or changes in expectations after the date of this press release.

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/33ef4243-4512-4a7f-9fc1-ed454f7a5da4

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