PLAINVIEW, NY, November 22, 2021 (GLOBE NEWSWIRE) – Veeco Instruments Inc. (NASDAQ: VECO) today announced that it has shipped the first LSA101 spike laser annealing system from its new plant in San Jose, Calif., To a major semiconductor manufacturer. Veeco’s new SEMI-compliant facility serves as the company’s center of excellence for the development and production of advanced laser annealing and packaging lithography systems for semiconductor applications.
“We are extremely proud to ship our first LSA system from our state-of-the-art facility in the heart of Silicon Valley,” commented Bill Miller, CEO of Veeco. “In line with the company’s growth strategy, this new manufacturing space allows Veeco to serve the world’s leading semiconductor chip suppliers with increased capacity and world-class laboratory space. We look forward to presenting this flagship location to our laser annealing and advanced packaging lithography customers for years to come. Thanks to the Veeco team who have worked diligently on an accelerated schedule to enable this exciting milestone in Veeco’s history. “
Veeco’s new facility includes approximately 70,000 square feet of manufacturing and engineering lab space and 30,000 square feet of office space. The manufacturing space will be almost double that of Veeco’s old factory in San Jose and will improve manufacturing efficiency. The new facility is specially designed to meet the growing demand for advanced laser annealing and packaging lithography technologies from Veeco.
Advanced scaling of semiconductor devices requires higher temperature for dopant activation with shorter time at temperature to avoid dopant diffusion. Veeco’s patented LSA101® and LSA201® Laser Spike Annealing (LSA) systems deliver the highest temperatures at the microsecond scale. The unique nature of the LSA platform enables our customers to anneal intricate patterns with uniformity and precision at high temperature, which is highly desired in advanced device processing.
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor processing equipment. Our proven ion beam, laser annealing, lithography, MOCVD, and unique wafer etching and cleaning technologies play a critical role in the manufacturing and packaging of advanced semiconductor devices. With equipment designed to optimize performance, efficiency and cost of ownership, Veeco holds leading technological positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.
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